LCPs in New High-Speed, High-Density Electronic Connectors

WEB EXCLUSIVE: Samtec, Inc., New Albany, Ind., a worldwide manufacturer of electronic interconnects, is using two families of liquid-crystal polymers from Ticona, Florence, Ky., in its new Seam/Seaf Series of high-speed, high-density connectors. Says Doug McCartin, HUB engineering manager at Samtec, “Our Searay high-density, open-pin-field grid arrays presented an interesting material challenge: We needed a proven halogen-free, high-performance polymer that could withstand technology for improved solder joint reliability and ensure compatibility with lead-free reflow processes and environmental initiatives.” Having  sampled several competitive materials with little success, Samtec  worked with Ticona to identify two solutions from a family of halogen-free, high-performance LCPs—Zenite 6130LX for the Seam Series, which is the mate to the Seaf Series that is injection molded with Vectra E135i.

These two inherently flame-resistant polymers met Samtec’s criteria for weld-line strength and excellent processability, including lead-free solderability. Zenite 6130LX, is a 30% glass-reinforced, lubricated LCP with a reportedly unique combination of toughness, stiffness, dimensional stability, and creep resistance, even at very high temperatures. It is said to offer improvements in weld-line strength, flatness, and toughness, as well as an HDT of 280 C.
Vectra E 135i is a 35% glass-filled LCP with improved flatness, heat resistance, flow, and toughness. It is said to offer low warp, high flow, high mechanical strength, and superior weld-line strength.