WEB EXCLUSIVE. A new thermoformable resin from Cereplast Inc. has higher heat resistance than competitive bioplastics and is also fully compostable. CP-TH-6000 is a PLA-based resin with heat resistance up to 155 C. The resin incorporates nanotechnology and a proprietary manufacturing process to boost heat resistance for packaging now made of PS, PE, or PET. The high-heat capability is partly obtained through processing, much like that for C-PET, according to William Kelly, senior v.p. of technology. He says time/temperature adjustments are required during the forming process to raise the sheet’s crystallinity and heat resistance. Mechanical properties are similar to Cereplast’s standard thermoforming resin, CP-TH-01. Application development efforts are currently focused on fast-food packaging. (310) 676-5000 * www.cereplast.com
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Editor PickLSR & Other Materials Know-How for Molders at April Conference
Materials and Additives are examples of the broad focus of Plastics Technology’s Molding 2017 Conference & Exhibit.