A new die system for extruded PS foam board from Extrusion Dies Industries (EDI), Chippewa Falls, Wis., is said to dramatically reduce downtime for product changeovers, enhance control over product dimensions, reduce scrap, and eliminate shutdowns for die maintenance.
EDI says the new XPS foam board die technology makes it possible to accomplish a product changeover on the fly in only 15 min, vs. the usual 8-10 hr.The added uptime offsets most of the output loss imposed by the switch to HFC blowing agents, EDI says.
Key features include a separate, independently adjusted forming box that makes possible product changeovers without stopping the production line; and an adjustable, full-manifold internal deckle that can be used to modify both the width and thickness of the board.
Foam board processor DiversiFoam Products reports that by using the new EDI system at its Rockford, Minn., plant, it has virtually eliminated downtime for scheduled thickness setups, making it possible to produce 11% more saleable product.
(715) 726-1201 • extrusiondies.com
Extrusion Dies, Inc.
911 Kurth Rd. Chippewa Falls, WI 54729-1443
Phone (715) 726-1201 Fax (715) 726-2205