A new epoxy resin system for electronic encapsulation and adhesives not only resists heat up to 450 F but is so flexible that you can literally tie it in a knot. It can be formulated for elongation up to 800%. It also offers extreme resistance to thermal shock and vibration for potting and bonding applications. Duralco 4538 from Cotronics Corp., Brooklyn, N.Y., cures at room temperature and reportedly can seal glass to brass, PTFE to ceramic, and ceramic to plastics such as nylon, PEEK, PPS, and phenolics. It comes in pint and gallon kits and premeasured packages.
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