MATERIALS: FR PC Versions Expand Continuous-Fiber-Reinforced TP Composites

At NPE2015, Lanxess' sub. Bond Laminates will highlight new FR versions with PC matrix now part of its Tepex line of continuous-fiber-reinforced thermoplastic composites for electronic applications.

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The Tepex range of continuous-fiber-reinforced thermoplastic high-performance composites from The Bond Laminates subsidiary of Lanxess, Pittsburgh, Penn., has been expanded to include halogen-free flame-retardant versions with a PC matrix, which will be highlighted at NPE2015. Their performance properties, low weight and ease of processing are said to make them especially suitable for the production of large, thin-walled and extremely stiff housing parts such as those used for notebooks, tablets, and TV sets. “They are simpler to produce and require less process engineering then aluminum or magnesium. And, compared to injection-molded component designs, Tepex can be used to produce thinner walls so that housings need less installation space,” says Bond Laminates’ managing director Jochen Bauder who sees major potential for applications in the consumer electronics industry.

The new Tepex FR grades have been shown to demonstrate exceptionally high flame retardance in tests to fire safety standard UL94. They achieved the top V0 classification on UL’s Yellow Card at specimen thicknesses between 0.4 and 2 millimeters.  Tepex FR is supplied mainly in thicknesses between 0.5 and 1.2 millimeters. Variations are available with glass, carbon or glass/carbon fiber reinforcement. The fiber volume content lies between 45% and 55%. The composite sheets reportedly exhibit excellent mechanical properties. For example, the flexural modulus of the carbon-reinforced grades lies between 40 and 54 GPa depending on the fiber content and the modules of the glass-fiber-reinforced grades between 20 and 24 GPa. 

Want to find or compare materials data for different resins, grades, or suppliers? Check out Plastic Technology’s Plaspec Global materials database.