WEB EXCLUSIVE: Ticona Engineering Polymers, Florence, Ky., has added a new family of high-flow grades of halogen-free, flame-retardant Vectra LCPs for use in portable electronic devices. Two new Vectra LCP grades were developed to address the latest trends in E/E requirements to fill thin walls of miniature, complex molded components found in smartphones, tablets, ultrabooks, and other communication devices. By applying new technologies, Ticona says it was able to reduce the melt viscosity without loss of mechanical properties.
Grade FIT70 for compact camera modules (CCM) and grade FIT72 for thin-wall connectors are both 35% glass/mineral-filled LCPs. FIT70 boasts high flow, dimensional stability over a wide range of operating temperatures, excellent surface smoothness required by high-precision autofocus systems, and good weldline strength in extremely thin walls. It is already in use in CCM products for mobile handset camera applications from South Korea’s Hysonic Co., Ltd. A Hysonic spokesman says Vectra FIT70 offers excellent weldline strength and surface quality that they were unable to achieve with other LCP materials. Hysonic also found it provides a broader processing window, which reduces the number of defects and translates into less scrap.
FIT72 for thin-wall connectors boasts improved flow while maintaining mechanical properties, excellent flatness before and after reflow soldering, and potential to increase number of cavities per tool.
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