Next-generation LSR will bond to additional engineering thermoplastics.

At a recent open house at its brand-new LIMS (Liquid Injection Molding System) Technical Center in Akron, Ohio, Shin-Etsu Silicones of America’s marketing manager, Eric Bishop, gave a hint of what’s in the pipeline for new LSR (liquid silicone rubber) product development. The company’s Select-Hesive LIMS KE2090 Series is designed for primerless adhesion to a variety of thermoplastics in insert overmolding or two-shot molding. KE2090, which complies with USP Class VI and ISO 10993 standards for healthcare applications, has already been shown to adhere to PC, PBT, modified PPO, PEEK, polysulfone (PSU), and polyphenylsulfone (PPSU). Bishop said a next-generation product will bond to PC, PPA, Ultem polyetherimide (PEI), and nylon 12. The earlier grade does stick to some grades of Ultem (from SABIC Innovative Plastics, Pittsfield, Mass.) but was not optimized for that resin.

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