A new, non-abrasive, non-chemical purging compound from the Dyna-Purge Div. of Shuman Plastics, Inc., Depew, N.Y., has been formulated to purge high-clarity resins without any residue. Company officials say Dyna-Purge C was formulated for transitioning to clear parts and to address what processors refer to as “milky drag,” resulting in faster changeover and less downtime.
Ease of use, unique cleaning characteristics, and broad temperature range (380-590 F) are said to make Dyna-Purge C effective for injection molders, extruders, compounders, and blow molders. It enables processors to purge hot runners and other tight clearances and improves overall changeover times with significant scrap reduction. All ingredients of the new formula are FDA-compliant.
Editor PickPolyolefin Pricing Update: Moving Towards May
Looks like PE prices remain flat while PP prices are poised for bigger drop than previously thought.