Three new PBTs from Lanxess Corp., Pittsburgh, offer improved heat resistance for producing molded interconnect devices (MIDs) with integral circuitry.

Three new PBTs from Lanxess Corp., Pittsburgh, offer improved heat resistance for producing molded interconnect devices (MIDs) with integral circuitry. These grades are formulated for the laser direct structuring process of LPKF Laser & Electronics, Wilsonville, Ore. This process allows a laser to "draw" the circuitry on a molded part, thereby activating a special additive to permit selective plating of the circuit lines on the plastic surface. Pocan DP7102 is a 25% mineral-filled injection grade with a melting point of about 225 C. It offers high flow and isotropic shrinkage for almost warp-free moldings. Pocan TP7140 LDS is a 40% mineral/glass-filled grade that withstands soldering temperatures. Its melting point is around 250 C and has a low CLTE. Pocan TP710-003 is a 25% mineral-filled grade for profile extrusion.

Lanxess Corp.
111 RIDC Park West Dr Pittsburgh, PA 15275
Phone (412) 809-1000 Fax (412) 519-2268