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Published: 1/11/2016
MATERIALS: Enhanced Copolyester Filament for 3D Printing

Eastman and colorFabbs launch enhanced next-generation 3D filament.

Published: 1/11/2016
MATERIALS: PC Film Offers Exceptional Formability,

Reportedly outperforms alternatives for complex thermoforming applications.

Published: 12/16/2015
MATERIALS: High-Strength LSRs for Medical Applications

Nusil's new LSRs boast tensile strengths of up to 50% greater than existing LSRs.

Published: 12/15/2015
MATERIALS: PC Film for Shatter-Resistant Touchscreens

SABIC's new PC film resin is said to be virtually unbreakable.  

Published: 12/14/2015
MATERIALS: High-Flow Elastomer Enhances PP Processing

ExxonMobil Chemicals' newest propylene-ethylene elastomers are aimed at enhancing processing of PP compounds in food packaging.

Published: 12/14/2015
ADDITIVES: FEP Foam Concentrates for LAN & Coaxial Cables

AGC Chemicals' new FEP foam concentrates enhance foamed LAN and coaxial cable insulation.

Published: 11/23/2015
MATERIALS: New Class of PE Film Resins Adds Fresh Downgauging Potential

New LLDPEs boast unmatched stiffness/toughness balance and processing ease. Better downgauging ahead.

Published: 11/23/2015
ADDITIVE MANUFACTURING: Polycarbonate for 3D Printing

Lower-temperature processing makes PC more adaptable to additive manufacturing.

Published: 10/22/2015
MATERIALS: High-Heat Stabilized Nylons for Electronics & Automotive

Lanxess has developed a new metal-free heat stabilizing system for its Durethan nylons.

Published: 10/22/2015
MATERIALS: PPA for High-Performance Electrical/Electronics Uses

Evonik's new PPA is aimed at high-end LEDs found in headlamps, flat-screen TVs and moveable lens module units for smartphones.

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