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Published: 9/7/2014
MATERIALS: Stiff Polyolefin Foam Boards For Automotive And Packaging

Offering great weight reduction potential are new stiff PP closed-cell foam boards from Sekisui.

Published: 9/7/2014
MATERIALS: Purging Compound For Use In A Broad Range Of Applications

Shuman Plastics' newest Dyna-Purge purging compound can be used in injection, extrusion, compounding, and blow molding applications.

Published: 9/7/2014
MATERIALS: TPU/Crosslinked Silicone Rubber for Overmolding TPEs

Hybrid of TPU and crossliked silicone rubber is safe for skin contact in wearable electronic applications.

Published: 8/22/2014
MATERIALS: TPEs For Consumer Electronics Feature Percept Authentication Technologies

PolyOne GLS's TPEs improve brand protection and reduce counterfeits for consumer electronics.

Published: 8/22/2014
MATERIALS: Cable Compound Technology Supports Extra High Voltage Direct Current Transmission

A next-generation extruded cable compound technology has been developed by Borealis and ABB.

Published: 8/22/2014
ADDITIVES: Antimicrobial Offers Long-Range Protection For Wide Range of Polyolefin Applications

A new broad-spectrum antimicrobial protection masterbatch positioned as a cost-effective option to silver-based additives.

Published: 7/25/2014
APPLICATION: Extrudable PC Used In Shell Of New Luggage

Bayer's extrudable PC produces lightweight, hard-shell suitcases.

Published: 7/24/2014
ADDITIVES: Antiblock For Films Combines Attributes Of Traditional Additives

New antiblock additive for polyolefin films delivers best attributes of talc, nepheline syenite and diotomaceous earth.

Published: 7/24/2014
MATERIALS: Enhanced COP For Medical Packaging

New COP has better mechanical and sealing properties.

Published: 7/24/2014
MATERIALS: Detectable Compounds For Food, Drug And Cosmetic Industries

Techmer PM's compounding division expands its portfolio of detectable resins.

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